The characteristics of the rigid-flex board determines that its application areas cover all the application areas of FPC in PCB,   such as:   mobile phone   Button board and side buttons, etc.   Computer and LCD screen   Motherboard and display screen, etc.   CD Walkman   Disk Drive   NOTEBOOK.   Latest use   Components such as the suspension circuit (Su ensi.N cireuit) of the hard disk drive (HDD, hard disk drive) and the xe package board, etc.

SMT and DIP are both ways to integrate parts on the PCB. The main difference is that SMT does not need to drill holes on the PCB. In DIP, the PIN pins of the parts need to be inserted into the holes that have been drilled.   SMT(Surface Mounted Technology)   Surface mount technology mainly uses mounters to mount some tiny parts on the PCB. The production process is: PCB board positioning, solder paste printing, mounter mounting, reflow oven and final inspection. With the development of technology,   SMT can also mount some large-size parts, for example, some larger-size mechanical parts can be mounted on the motherboard.   DIP Dip stands for "plug-in", that is, inserting parts on the PCB board. Because the parts are large in size and not suitable for placement or the manufacturer's production process cannot use SMT technology, the parts are integrated in the form of plug-ins.   At present, there are two implementation methods of manual plug-in and robot plug-in in the industry. The main production process is: sticking adhesive (to prevent tin plating to the place where it should not be), plug-in, inspection, wave soldering, and brushing (removing in the furnace Stains left in the process) and made inspection.

Multi-substrates are made by stacking two or more circuits on top of each other, and they have reliable pre-set interconnections.   Since drilling and plating have been completed before all the layers are rolled together, this technique violates the traditional manufacturing process from the beginning.   The two innermost layers are composed of traditional double panels, while the outer layers are different, they are composed of independent single panels.   Before rolling, the inner substrate will be drilled, through-hole plating, pattern transfer, development and etching.   The outer layer to be drilled is the signal layer, which is plated through in such a way that a balanced copper ring is formed on the inner edge of the through hole.   The layers are then rolled together to form a multi-substrate, which can be interconnected (between components) using wave soldering.    

Material used FR4 – Laminates HTC (High Thermal Conductivity) – Teflon – FR4 ceramics FR4 Tg Mid, High – FR4 low Er and low Lf – Laminates Halogen Free Thickness of base PCB (including copper when> 0.8mm) Standard 1,6 mm – To request from 0,5 to 5 mm Prepreg To request Thickness of base copper Standard (18um, 35um, 70um), Advanced (9um, 12um, 105um, 140um, 170um, 210um) Drilling Mechanics (minimum drill d=0,20mm), mechanical controlled height Laser via (max Ø laser via 0,1mmm – aspect ratio 1:1), blind and buried, for lay up sequential (HDI) Surface Finishes Passivated Copper OSP – HAL Lead Free or Sn/Pb – Electrolytic gold Immersion Gold (ENIG) – Silver or Immersion Tin Max. number of layer: 24

Materiali utilizzabili Polymide (e/o Kapton) – FR4 Tg Mid, High – FR4 a bassa Er – Laminati Halogen Free (only Rigid version) Basic flex thickness 0.1mm min Thickness of base copper 9um, 12um, 18um, 35um, 70um Surface Finishes Passivated Copper – ENIG Hole Copper Plating: 25um (average) – 20um (min. point) – Rigid 12um (average) – 10um (min. point) – Flex)

The aluminum based (metal-based heat sink) is a low-alloyed Al-Mg-Si series high plastic alloy plate.   It has good thermal conductivity, electrical insulation performance and mechanical processing performance.   Compared with FR-4, the aluminum substrate can carry higher current with the same thickness and the same line width.   The aluminum substrate can withstand voltage up to 4500V and the thermal conductivity is greater than 2.0. In the industry, aluminum substrates are the mainstay.   Mainly used in LED daily and industrial lighting, light bar display, LED/OLED.