Shenzhen Hengxunda Circuit Technology Co.,LTD
products
products
Home > products > Double Sided PCB > FPC polyimide material fpcb phone camera fpc fabrication surface finished ENIG 0.05um flex circuits manufacturer
FPC  polyimide material fpcb phone camera fpc fabrication surface finished ENIG 0.05um flex circuits manufacturer

FPC polyimide material fpcb phone camera fpc fabrication surface finished ENIG 0.05um flex circuits manufacturer

Product Details

Place of Origin: China

Brand Name: hengsheng

Certification: ISO 9001,UL,CE,ROHS

Model Number: HSF168

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: carton

Delivery Time: 7-12 working days

Payment Terms: T/T or PAYPAL, Western Union

Supply Ability: 50000pcs/month

Get Best Price
Highlight:
Base Material:
Flexible
Copper Thickness:
1OZ
Board Thickness:
0.1mm
Min. Hole Size:
0.3MM
Min. Line Width:
0.3MM
Min. Line Spacing:
0.3MM
Surface Finishing:
OSP
Base Material:
Flexible
Copper Thickness:
1OZ
Board Thickness:
0.1mm
Min. Hole Size:
0.3MM
Min. Line Width:
0.3MM
Min. Line Spacing:
0.3MM
Surface Finishing:
OSP
FPC polyimide material fpcb phone camera fpc fabrication surface finished ENIG 0.05um flex circuits manufacturer

FPC  polyimide material fpcb phone camera fpc fabrication surface finished ENIG 0.05um flex circuits manufacturer 0

 

Process Capability - Technical Parameters(FPC)
Content Common Special Surface treatment Thickness
Minimum line width 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um
Minimum line spacing 0.07mm 0.05mm
Minimum Drilling aperture Φ 0.15mm Φ 0.1mm
Aperture Tolerance ±0.1mm ±0.05mm Chemical immersion gold Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (double panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) 610*1650mm Electroplated hard gold Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance ±10% Electroplated pure tin Sn:3-7um
Maximum production layer 12L
Thickness To Diameter Ratio 2:1(Minimum aperture 0.1mm)
5:1(Minimum aperture 0.2mm) Anti-oxidation  
8:1(Minimum aperture 0.3mm)
Monthly production capacity/m² 16000 m²
 
Material
Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz)
Constantan
Silver Paste
Copper Ink
Adhesive Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film PI(0.5mil,1mil,2mil)(Yellow, White, Black)
PET(1mil,2mil)
Solder mask (green, yellow, black...)
Glue 3M467,3M468,3M9077,TESA8853...
Reinforcement Type PI,FR4,PET,Steel,Aluminum...