products

Home > products > PCB Assembly > circuit board assembly services low volume pcb assembly surface mount pcb electonics pcb components assembly

Catagories

PCB Design

(2)

Contacts

Contacts: Ms. angelina

Tel: 86--15889447462

Fax: 86-755-23061612

Contact Now

Mail Us

circuit board assembly services low volume pcb assembly surface mount pcb electonics pcb components assembly

Name: circuit board assembly services low volume pcb assembly surface mount pcb electonics pcb components assembly
Brand: hengsheng
SKU: HS4015
Price: 0.1 USD
Availability: InStock
Rating: 4.7 (159 reviews)

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL, ROHS,SGS,ISO9001

Model Number: HS4015

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd per pcs

Packaging Details: 25kgs/carton, vacuumed packing

Delivery Time: 7-10work days

Payment Terms: T/T, Western Union,paypal

Supply Ability: 10000pcs

Get Best Price

Product Details

Product Description

Highlight:

Board Thickness:	1.6mm	Copper Thickness:	1oz
Lead Time:	7-10 Days	Min. Annular Ring:	0.2mm
Min. Hole Size:	0.2mm	Min. Line Spacing:	0.1mm
Min. Line Width:	0.1mm	PCB Layer:	2-layer
Product Name:	PCB Assembly	Silkscreen Color:	White
Solder Mask Color:	Green	Surface Finish:	HASL
Warranty:	1 Year

Board Thickness:	1.6mm
Copper Thickness:	1oz
Lead Time:	7-10 Days
Min. Annular Ring:	0.2mm
Min. Hole Size:	0.2mm
Min. Line Spacing:	0.1mm
Min. Line Width:	0.1mm
PCB Layer:	2-layer
Product Name:	PCB Assembly
Silkscreen Color:	White
Solder Mask Color:	Green
Surface Finish:	HASL
Warranty:	1 Year

circuit board assembly services low volume pcb assembly surface mount pcb electonics pcb components assembly

Process Capability - Technical Parameters(FPC)
Content	Common	Special	Surface treatment	Thickness
Minimum line width	0.07mm	0.05mm	Electroplated nickel gold	Ni:3-9um;Au:0.03-0.1um
Minimum line spacing	0.07mm	0.05mm
Minimum Drilling aperture	Φ 0.15mm	Φ 0.1mm
Aperture Tolerance	±0.1mm	±0.05mm	Chemical immersion gold	Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel)	610mm*1200mm(Exposure limit)	250mm*35mm(only develop test samples)
Maximum imposition size (double panel)	610mm*1200mm(Exposure limit)	250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid)	610*1650mm		Electroplated hard gold	Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance	±10%		Electroplated pure tin	Sn:3-7um
Maximum production layer	12L
Thickness To Diameter Ratio	2:1(Minimum aperture 0.1mm)
	5:1(Minimum aperture 0.2mm)		Anti-oxidation
	8:1(Minimum aperture 0.3mm)
Monthly production capacity/m²	16000 m²

Material
Substrate Material	PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium	Copper foil(1/3oz,1/2oz,1oz,2oz)
	Constantan
	Silver Paste
	Copper Ink
Adhesive	Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film	PI(0.5mil,1mil,2mil)(Yellow, White, Black)
	PET(1mil,2mil)
	Solder mask (green, yellow, black...)
Glue	3M467,3M468,3M9077,TESA8853...
Reinforcement Type	PI,FR4,PET,Steel,Aluminum...

Tags: