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circuit board assembly services low volume pcb assembly surface mount pcb electonics pcb components assembly

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL, ROHS,SGS,ISO9001

Model Number: HS4015

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd per pcs

Packaging Details: 25kgs/carton, vacuumed packing

Delivery Time: 7-10work days

Payment Terms: T/T, Western Union,paypal

Supply Ability: 10000pcs

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Board Thickness:
1.6mm
Copper Thickness:
1oz
Lead Time:
7-10 Days
Min. Annular Ring:
0.2mm
Min. Hole Size:
0.2mm
Min. Line Spacing:
0.1mm
Min. Line Width:
0.1mm
PCB Layer:
2-layer
Product Name:
PCB Assembly
Silkscreen Color:
White
Solder Mask Color:
Green
Surface Finish:
HASL
Warranty:
1 Year
Board Thickness:
1.6mm
Copper Thickness:
1oz
Lead Time:
7-10 Days
Min. Annular Ring:
0.2mm
Min. Hole Size:
0.2mm
Min. Line Spacing:
0.1mm
Min. Line Width:
0.1mm
PCB Layer:
2-layer
Product Name:
PCB Assembly
Silkscreen Color:
White
Solder Mask Color:
Green
Surface Finish:
HASL
Warranty:
1 Year
circuit board assembly services low volume pcb assembly surface mount pcb electonics pcb components assembly

circuit board assembly services  low volume pcb assembly surface mount pcb electonics pcb components assembly 0

 

Process Capability - Technical Parameters(FPC)
Content Common Special Surface treatment Thickness
Minimum line width 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um
Minimum line spacing 0.07mm 0.05mm
Minimum Drilling aperture Φ 0.15mm Φ 0.1mm
Aperture Tolerance ±0.1mm ±0.05mm Chemical immersion gold Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (double panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) 610*1650mm Electroplated hard gold Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance ±10% Electroplated pure tin Sn:3-7um
Maximum production layer 12L
Thickness To Diameter Ratio 2:1(Minimum aperture 0.1mm)
5:1(Minimum aperture 0.2mm) Anti-oxidation  
8:1(Minimum aperture 0.3mm)
Monthly production capacity/m² 16000 m²
 
Material
Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz)
Constantan
Silver Paste
Copper Ink
Adhesive Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film PI(0.5mil,1mil,2mil)(Yellow, White, Black)
PET(1mil,2mil)
Solder mask (green, yellow, black...)
Glue 3M467,3M468,3M9077,TESA8853...
Reinforcement Type PI,FR4,PET,Steel,Aluminum...

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