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Home > products > PCB Assembly > pcb board assembly custom pcb assembly small run pcb low volume circuit baord assembly custom circuit board assembly
pcb board assembly custom pcb assembly small run pcb low volume circuit baord assembly custom circuit board assembly

pcb board assembly custom pcb assembly small run pcb low volume circuit baord assembly custom circuit board assembly

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL,ISO 9001, CE, ROHS

Model Number: HSF1688

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: carton

Delivery Time: 5-7working days

Payment Terms: TT/PAYPAL/Western Union

Supply Ability: 50000pcs/month

Get Best Price
Highlight:
Item:
ODM OEM LED PCBA
Service:
PCB$PCBA, ODM And OEM
Pcb Assembly Method:
SMT
Application:
Industry/medical/consume Electronic
Item:
ODM OEM LED PCBA
Service:
PCB$PCBA, ODM And OEM
Pcb Assembly Method:
SMT
Application:
Industry/medical/consume Electronic
pcb board assembly custom pcb assembly small run pcb low volume circuit baord assembly custom circuit board assembly

pcb board assembly custom pcb assembly small run pcb low volume circuit baord assembly custom circuit board assembly 0

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times

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