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Home > products > PCB Assembly > double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board
double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board

double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board

Product Details

Place of Origin: china

Brand Name: hascend

Certification: UL,TS16949

Model Number: HAS20016

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: carton

Delivery Time: 5-7working days

Payment Terms: TT/PAYPAL/Western Union

Supply Ability: 50000pcs/month

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Base Material:
FR4
Copper Thickness:
1oz
Board Thickness:
1.6mm
Min. Hole Size:
0.2mm
Min. Line Width:
0.13mm
Min. Line Spacing:
0.13mm
Surface Finishing:
ENIG
Number Of Layers:
4-Layer
Base Material:
FR4
Copper Thickness:
1oz
Board Thickness:
1.6mm
Min. Hole Size:
0.2mm
Min. Line Width:
0.13mm
Min. Line Spacing:
0.13mm
Surface Finishing:
ENIG
Number Of Layers:
4-Layer
double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board

double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board 0

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times

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