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Home > products > PCB Assembly > pcb smt assembly pcb assembly protorype service pcba circuit board low volume circuit board assembly lcd display pcb smt
pcb smt assembly pcb assembly protorype service pcba circuit board low volume circuit board assembly lcd display pcb smt

pcb smt assembly pcb assembly protorype service pcba circuit board low volume circuit board assembly lcd display pcb smt

Product Details

Place of Origin: china

Brand Name: hascend

Certification: UL,TS16949,ROHS, ISO9000

Model Number: HAS20066

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: carton

Delivery Time: 5-7working days

Payment Terms: T/T, Western Union, PAYPAL

Supply Ability: 50000pcs/month

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Base Material:
FR-4
Board Thickness:
1.6MM
Type:
Pcba Design
Application:
Pcb Assembly Nanufacturer
Usage:
OEM Electronics
Base Material:
FR-4
Board Thickness:
1.6MM
Type:
Pcba Design
Application:
Pcb Assembly Nanufacturer
Usage:
OEM Electronics
pcb smt assembly pcb assembly protorype service pcba circuit board low volume circuit board assembly lcd display pcb smt

pcb smt assembly pcb assembly protorype service pcba circuit board low volume circuit board assembly lcd display pcb smt 0

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times

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