Product Details
Place of Origin: China
Brand Name: hengsheng
Certification: ISO 9001,UL,CE,ROHS
Model Number: HSF2303432A
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: USD 0.1-5/pcs
Packaging Details: 25kgs/carton, vacuumed packing
Delivery Time: 7-10 working days
Payment Terms: T/T or PAYPAL, Western Union
Supply Ability: 100000pcs per month
Base Material: |
FR-4 |
Copper Thickness: |
1OZ |
Board Thickness: |
1.6MM |
Min. Hole Size: |
0.2MM |
Min. Line Width: |
0.127mm |
Min. Line Spacing: |
0.127mm |
Surface Finishing: |
ENIG |
Number Of Layers: |
6-Layer |
Base Material: |
FR-4 |
Copper Thickness: |
1OZ |
Board Thickness: |
1.6MM |
Min. Hole Size: |
0.2MM |
Min. Line Width: |
0.127mm |
Min. Line Spacing: |
0.127mm |
Surface Finishing: |
ENIG |
Number Of Layers: |
6-Layer |
| Process Capability And Checking Parameters(Hard Board) | |||||||
| NO | ITEM | Technical Capabilities | |||||
| 1 | Layers | 1-38L | |||||
| 2 | Max.Board Size | 1200*610mm | |||||
| 48"*24" | |||||||
| 3 | Finished Board Thickness | 0.2mm--10.0mm | |||||
| 0.008"--0.4" | |||||||
| 4 | Finished Copper Thickness | 17um-420um | |||||
| 0.5OZ--12OZ | |||||||
| 5 | Min.Trace Width/Space | 0.075mm/0.065mm | |||||
| 0.003"/0.0026" | |||||||
| 6 | Min.Hole Size | 0.15mm | |||||
| 0.006" | |||||||
| 7 | Hole Dim. Tolerance(PTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 8 | Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 9 | Drill Location Tolerance | ±0.05mm | |||||
| ±0.002" | |||||||
| 10 | V-Cut Degrees | 20-90 ºC | |||||
| 20DEG-90DEG | |||||||
| 11 | Min.V-Cut PCB Thickness | 0.4mm | |||||
| 0.016" | |||||||
| 12 | N/C Routing Tolerance | ±0.1mm | |||||
| ±0.004" | |||||||
| 13 | Min.Blind/Buried Via | 0.15mm | |||||
| 0.06" | |||||||
| 14 | Plug Hole Size | 0.2mm--0.6mm | |||||
| 0.008"--0.024" | |||||||
| 15 | Min.BGA PAD | 0.2mm | |||||
| 0.008" | |||||||
| 16 | Materials | FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB | |||||
| 17 | Surface Finish | HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F | |||||
| 18 | Warp & Twist | ≤0.75% | |||||
| 19 | Electrical Testing | 50--300V | |||||
| 20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% | |||||
| 21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles | |||||
| 22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm | |||||
| 23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times | |||||
