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Home > products > Main/Mother Board PCB > 8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control
8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control

8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL

Model Number: HS6025

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: caton

Delivery Time: 7-10work days

Payment Terms: T/T, Western Union,paypal

Supply Ability: 50000pcs/month

Get Best Price
Highlight:
Material:
FR-4
Layer:
8
Cooper:
1/1oz
Mask:
Green
Finished:
Gold Platting
Material:
FR-4
Layer:
8
Cooper:
1/1oz
Mask:
Green
Finished:
Gold Platting
8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control

8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control 0

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times