circuit board components

Process Capability And Checking Parameters(Hard Board) NO ITEM Technical Capabilities 1 Layers 1-38L 2 Max.Board Size 1200*610mm 48"*24" 3 Finished Board Thickness 0.2mm--10.0mm 0.008"--0.4" 4 Finished Copper ... Read More

Detailed Product Description SMT and DIP are both ways to integrate parts on the PCB. The main difference is that SMT does not need to drill holes on the PCB. In DIP, the PIN pins of the parts need to be ... Read More

Process Capability - Technical Parameters(FPC) Content Common Special Surface treatment Thickness Minimum line width 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um Minimum line spacing 0.07mm 0... Read More

Process Capability - Technical Parameters(FPC) Content Common Special Surface treatment Thickness Minimum line width 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um Minimum line spacing 0.07mm 0... Read More

Multi-substrates are made by stacking two or more circuits on top of each other, and they have reliable pre-set interconnections. Since drilling and plating have been completed before all the layers are rolled ... Read More

The characteristics of the rigid-flex board determines that its application areas cover all the application areas of FPC in PCB, such as: mobile phone Button board and side buttons, etc. Computer and LCD screen ... Read More