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Home > products > Double Sided PCB > doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided
doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided

doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided

Product Details

Place of Origin: China

Certification: ISO 9001,UL,CE,ROHS

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: carton

Delivery Time: 5-7working days

Payment Terms: T/T or PAYPAL, Western Union

Supply Ability: 50000pcs/month

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Highlight:
Base Material:
FR-4
Copper Thickness:
1OZ
Board Thickness:
1.0MM
Min. Hole Size:
0.2MM
Min. Line Width:
0.2MM
Min. Line Spacing:
0.2MM
Surface Finishing:
Lead-Free+immersion Gold
Base Material:
FR-4
Copper Thickness:
1OZ
Board Thickness:
1.0MM
Min. Hole Size:
0.2MM
Min. Line Width:
0.2MM
Min. Line Spacing:
0.2MM
Surface Finishing:
Lead-Free+immersion Gold
doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided

doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided 0

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times