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Home > products > Double Sided PCB > FR4 double sided pcb double sided pcb HASL pcb used in medical apparatus and instruments double sided prototype pcb
FR4 double sided pcb double sided pcb HASL pcb used in medical apparatus and instruments double sided prototype pcb

FR4 double sided pcb double sided pcb HASL pcb used in medical apparatus and instruments double sided prototype pcb

Product Details

Place of Origin: China

Certification: ISO 9001,UL,CE,ROHS

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: carton

Delivery Time: 7-10working days

Payment Terms: T/T or PAYPAL, Western Union

Supply Ability: 50000pcs/month

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Highlight:
Base Material:
FR-4
Copper Thickness:
1OZ
Board Thickness:
1.6MM
Min. Hole Size:
0.2MM
Min. Line Width:
0.2MM
Min. Line Spacing:
0.3MM
Surface Finishing:
Lead-Free
Base Material:
FR-4
Copper Thickness:
1OZ
Board Thickness:
1.6MM
Min. Hole Size:
0.2MM
Min. Line Width:
0.2MM
Min. Line Spacing:
0.3MM
Surface Finishing:
Lead-Free
FR4 double sided pcb double sided pcb HASL pcb used in medical apparatus and instruments double sided prototype pcb

FR4 double sided pcb double sided pcb HASL pcb used in medical apparatus and instruments double sided prototype pcb 0

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times