Product Details
Place of Origin: china
Brand Name: hengsheng
Certification: UL
Model Number: HSF168
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: 0.1usd
Packaging Details: caton
Delivery Time: 7-10work days
Payment Terms: T/T, Western Union,paypal
Supply Ability: 50000pcs/month
Type: |
Customized Electronics |
Base Material: |
FR-4 |
Board Thickness: |
1.6mm |
Copper Thickness: |
35um |
Surface Finishing: |
Immersion Gold |
Min. Line Spacing: |
3mil(0.075mm) |
Min. Line Width: |
3mil(0.075mm) |
Min. Hole Size: |
0.2mm |
Color: |
Green, Blue, Yellow |
Test: |
E-test/Fixture Test |
Type: |
Customized Electronics |
Base Material: |
FR-4 |
Board Thickness: |
1.6mm |
Copper Thickness: |
35um |
Surface Finishing: |
Immersion Gold |
Min. Line Spacing: |
3mil(0.075mm) |
Min. Line Width: |
3mil(0.075mm) |
Min. Hole Size: |
0.2mm |
Color: |
Green, Blue, Yellow |
Test: |
E-test/Fixture Test |
Process Capability And Checking Parameters(Rigid Board) | |||||||
NO | ITEM | Technical Capabilities | |||||
1 | Layers | 1-38L | |||||
2 | Max.Board Size | 1200*610mm | |||||
48"*24" | |||||||
3 | Finished Board Thickness | 0.2mm--10.0mm | |||||
0.008"--0.4" | |||||||
4 | Finished Copper Thickness | 17um-420um | |||||
0.5OZ--12OZ | |||||||
5 | Min.Trace Width/Space | 0.075mm/0.065mm | |||||
0.003"/0.0026" | |||||||
6 | Min.Hole Size | 0.15mm | |||||
0.006" | |||||||
7 | Hole Dim. Tolerance(PTH) | ±0.05mm | |||||
±0.002" | |||||||
8 | Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||
±0.002" | |||||||
9 | Drill Location Tolerance | ±0.05mm | |||||
±0.002" | |||||||
10 | V-Cut Degrees | 20-90 ºC | |||||
20DEG-90DEG | |||||||
11 | Min.V-Cut PCB Thickness | 0.4mm | |||||
0.016" | |||||||
12 | N/C Routing Tolerance | ±0.1mm | |||||
±0.004" | |||||||
13 | Min.Blind/Buried Via | 0.15mm | |||||
0.06" | |||||||
14 | Plug Hole Size | 0.2mm--0.6mm | |||||
0.008"--0.024" | |||||||
15 | Min.BGA PAD | 0.2mm | |||||
0.008" | |||||||
16 | Materials | FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB | |||||
17 | Surface Finish | HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F | |||||
18 | Warp & Twist | ≤0.75% | |||||
19 | Electrical Testing | 50--300V | |||||
20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% | |||||
21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles | |||||
22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm | |||||
23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times | |||||
Process Capability - Technical Parameters(FPC) | |||||
Content | Common | Special | Surface treatment | Thickness | |
Minimum line width | 0.07mm | 0.05mm | Electroplated nickel gold | Ni:3-9um;Au:0.03-0.1um | |
Minimum line spacing | 0.07mm | 0.05mm | |||
Minimum Drilling aperture | Φ 0.15mm | Φ 0.1mm | |||
Aperture Tolerance | ±0.1mm | ±0.05mm | Chemical immersion gold | Ni:3-5um;Au:0.03-0.1um | |
Maximum imposition size (single panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | |||
Maximum imposition size (double panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | |||
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) | 610*1650mm | Electroplated hard gold | Ni:2-9um;Au:0.1-0.3um | ||
Finished board impedance tolerance | ±10% | Electroplated pure tin | Sn:3-7um | ||
Maximum production layer | 12L | ||||
Thickness To Diameter Ratio | 2:1(Minimum aperture 0.1mm) | ||||
5:1(Minimum aperture 0.2mm) | Anti-oxidation | ||||
8:1(Minimum aperture 0.3mm) | |||||
Monthly production capacity/m² | 16000 m² | ||||
Material | |||||
Substrate Material | PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) | ||||
Conductive Medium | Copper foil(1/3oz,1/2oz,1oz,2oz) | ||||
Constantan | |||||
Silver Paste | |||||
Copper Ink | |||||
Adhesive | Epoxy resin, Acrylic, Adhesion | ||||
Solder Mask / Protective Film | PI(0.5mil,1mil,2mil)(Yellow, White, Black) | ||||
PET(1mil,2mil) | |||||
Solder mask (green, yellow, black...) | |||||
Glue | 3M467,3M468,3M9077,TESA8853... | ||||
Reinforcement Type | PI,FR4,PET,Steel,Aluminum... |
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