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multilayer printed circuit board 6layer pcb maker ENIG for mother board and main board pcb lcd monitor controller pcb

multilayer printed circuit board 6layer pcb maker ENIG for mother board and main board pcb lcd monitor controller pcb

Product Details

Place of Origin: China

Brand Name: Hengsheng

Certification: ISO 9001,UL,CE,ROHS

Model Number: HSBG01104A

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: carton

Delivery Time: 5-7working days

Payment Terms: T/T or PAYPAL, Western Union

Supply Ability: 50000pcs/month

Get Best Price
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multilayer pcb

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4layers pcb

Type:
Electronic Board, Lcd Monitor Pcb
Base Material:
FR-4
Board Thickness:
1.6mm
Surface Finishing:
Immerson Gold
Min. Line Spacing:
0.15mm
Min. Line Width:
0.15mm
Min. Hole Size:
0.30mm
Copper Thickness:
1/1/1/1oz
Type:
Electronic Board, Lcd Monitor Pcb
Base Material:
FR-4
Board Thickness:
1.6mm
Surface Finishing:
Immerson Gold
Min. Line Spacing:
0.15mm
Min. Line Width:
0.15mm
Min. Hole Size:
0.30mm
Copper Thickness:
1/1/1/1oz
multilayer printed circuit board 6layer pcb maker ENIG for mother board and main board pcb lcd monitor controller pcb

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Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times