Product Description:
The 6 layer PCB is a highly reliable and versatile multilayer PCB designed to meet the demanding requirements of modern electronic applications. Engineered with precision and advanced manufacturing techniques, this PCB offers exceptional performance, durability, and electrical integrity, making it an ideal choice for complex circuit designs and high-density electronic assemblies.
One of the standout features of this 6 layer PCB is its construction using HIGH TG FR4 material. HIGH TG FR4 refers to a high glass transition temperature fiberglass epoxy laminate, which provides superior thermal stability and mechanical strength. This ensures that the PCB can withstand elevated operating temperatures and harsh environmental conditions without compromising its structural integrity or electrical performance. The use of HIGH TG FR4 makes this multilayer PCB especially suitable for applications in automotive, aerospace, telecommunications, and industrial sectors where reliability is paramount.
The multilayer design of this PCB includes six distinct copper layers, allowing for efficient signal routing and enhanced electrical performance. The copper thickness ranges from 18 to 105 micrometers (um), giving designers flexibility to select the optimal copper weight for their specific current carrying and thermal dissipation requirements. The multiple layers help reduce electromagnetic interference (EMI) and crosstalk between signal traces, improving signal integrity and overall circuit functionality.
In addition to the standard through-hole vias, this 6 layer PCB incorporates blind via PCB technology, which enables connections between inner layers without penetrating the entire board. Blind vias are crucial in high-density circuit designs as they save valuable board space and allow for more complex routing schemes. This feature enhances the PCB’s capability to support miniaturized and compact electronic devices while maintaining excellent electrical connectivity.
Attention to detail is evident in the PCB’s trace spacing, with a minimum trace spacing of 4 mil. This fine trace spacing allows for high-density circuit layouts, accommodating intricate designs and increasing the circuit complexity that the PCB can handle. It also contributes to reducing the overall size of the electronic assembly, making it suitable for applications where space is at a premium.
The PCB is finished with a high-quality solder mask available in both blue solder mask and green solder mask colors. The solder mask serves as a protective layer, preventing oxidation and short circuits by insulating copper traces and pads. The availability of blue and green solder mask options provides aesthetic flexibility and helps in identifying different layers or versions of the PCB during manufacturing and assembly processes. The solder mask’s excellent adhesion and resistance to soldering heat ensure that the PCB maintains its reliability throughout the manufacturing and operational lifecycle.
Quality assurance is a critical aspect of this 6 layer PCB, and it undergoes 100% electrical testing before delivery. This rigorous testing process verifies the continuity, isolation, and overall electrical performance of every circuit on the board. By implementing 100% electrical test coverage, the manufacturer guarantees that only defect-free PCBs reach the customer, minimizing the risk of failures and improving product reliability in the field.
In summary, the 6 layer PCB with HIGH TG FR4 material is a top-tier multilayer PCB solution that combines thermal resilience, mechanical strength, and advanced electrical features such as blind vias and fine trace spacing. Its copper thickness options, dual solder mask color choices, and comprehensive 100% electrical testing make it an excellent choice for engineers and designers seeking a robust, high-performance printed circuit board for complex and demanding electronic applications.
Applications:
The 6 layer PCB product with a green solder mask is an ideal solution for a wide range of high-performance electronic applications. Its design incorporates advanced features such as a minimum hole size of 0.2MM, 1oz copper thickness, and compliance with RoHS standards, making it suitable for environmentally conscious manufacturing. The six-layer configuration offers enhanced signal integrity and robust power distribution, which is essential in complex circuit designs.
This 6 layer PCB is particularly well-suited for use in HDI PCB (High-Density Interconnect) applications, where space-saving and high wiring density are critical. The inclusion of blind via PCB technology further enhances its capability to support multi-layer interconnections without compromising the board’s overall size. This makes it an excellent choice for compact devices such as smartphones, tablets, and wearable electronics that demand high performance in limited space.
The use of HIGH TG FR4 material in the PCB construction ensures excellent thermal stability and mechanical strength, which is crucial for applications exposed to elevated temperatures or harsh operating environments. This attribute makes the 6 layer PCB ideal for automotive electronics, industrial control systems, and aerospace applications where reliability and durability are paramount.
In addition, the green solder mask not only provides a professional appearance but also offers protection against oxidation and contamination during assembly and operation. This protective layer contributes to improved solder joint reliability and overall product longevity.
Typical scenarios where this 6 layer PCB excels include telecommunications equipment, medical devices, and advanced computing systems. Its multi-layer design supports complex signal routing and power distribution needed in high-speed digital circuits, RF modules, and power management units. The combination of RoHS compliance and high-quality materials ensures that the product meets stringent environmental and performance standards required in modern electronics manufacturing.
Overall, the 6 layer PCB with green solder mask, 1oz copper thickness, minimum 0.2MM hole size, and advanced features like blind via PCB and HIGH TG FR4 substrate represents a versatile and reliable choice across a multitude of demanding application occasions and scenarios, from consumer electronics to industrial and aerospace sectors.
Customization:
Our 6 layer PCB product offers superior customization services tailored to meet your specific requirements. Featuring a copper thickness of 1oz (18-105um), this multilayer PCB ensures excellent electrical performance and durability. Constructed with high-quality FR4 TG170 material, it provides enhanced thermal resistance and mechanical strength for demanding applications.
Choose from multiple solder mask colors, including the popular Blue Solder Mask and Green Solder Mask options, to best suit your design and branding needs. Our 6 layer PCB is also available in HDI PCB configurations, allowing for higher density interconnections and more compact designs.
Whether you require precise layer stack-up, controlled impedance, or advanced surface finishes, our product customization services are designed to deliver reliable and high-performance multilayer PCBs that meet industry standards and your exact specifications.
Support and Services:
Our 6 layer PCB product is designed to meet high-performance requirements and ensure reliable operation in complex electronic applications. We provide comprehensive technical support to assist you at every stage of your project, from design to manufacturing and testing.
Our experienced technical support team is available to help with design optimization, layer stack-up recommendations, material selection, and signal integrity considerations specific to 6 layer PCBs. We also offer guidance on thermal management and impedance control to enhance the performance of your final product.
In addition to technical assistance, we provide a range of services including prototype fabrication, quick-turn production, and rigorous quality inspections to ensure your 6 layer PCBs meet industry standards and your exact specifications.
We are committed to delivering exceptional support and services to help you achieve the best results with our 6 layer PCB solutions, ensuring your project progresses smoothly from concept to completion.
Packing and Shipping:
Our 6 layer PCBs are carefully packaged to ensure maximum protection during transit. Each PCB is individually wrapped with anti-static bubble wrap to prevent any electrostatic discharge damage. The boards are then placed in a sturdy cardboard box with additional cushioning materials to avoid any physical impact.
For shipping, we use reliable courier services that provide tracking and insurance options. Depending on your location and preference, we offer standard, expedited, and express shipping methods to meet your delivery requirements. All shipments are handled with care to ensure your 6 layer PCBs arrive safely and on time.
FAQ:
Q1: What are the typical applications for a 6 layer PCB?
A 6 layer PCB is commonly used in complex electronic devices requiring high-density circuitry, such as telecommunications equipment, computer motherboards, medical devices, and automotive electronics.
Q2: What materials are used in the construction of a 6 layer PCB?
6 layer PCBs are typically made using FR4 as the substrate material, combined with copper foil for the conductive layers. The layers are laminated together with prepreg and core materials to ensure durability and electrical performance.
Q3: What is the typical thickness of a 6 layer PCB?
The standard thickness of a 6 layer PCB is usually around 1.6mm, but it can vary between 1.0mm to 2.0mm depending on specific design requirements.
Q4: How does the layer stack-up work in a 6 layer PCB?
A 6 layer PCB typically includes signal layers on the outer and inner layers, with dedicated power and ground planes to reduce electromagnetic interference and improve signal integrity.
Q5: What is the minimum trace width and spacing achievable on a 6 layer PCB?
The minimum trace width and spacing can vary, but generally, a 6 layer PCB can support trace widths and spacing as small as 4 mils (0.1mm), allowing for high-density circuit designs.
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