Product Details
Payment & Shipping Terms
Solder Mask Color: |
Green |
Copper Thickness: |
1oz |
Rohs Compliance: |
Yes |
No Of Layers: |
6 Layer |
Via Type: |
Blind Hole |
Layers: |
6 |
Copper: |
18-105um |
Material: |
FR4 |
Solder Mask Color: |
Green |
Copper Thickness: |
1oz |
Rohs Compliance: |
Yes |
No Of Layers: |
6 Layer |
Via Type: |
Blind Hole |
Layers: |
6 |
Copper: |
18-105um |
Material: |
FR4 |
Our 6 layer PCB is an advanced printed circuit board designed to meet the rigorous demands of modern electronic applications. Featuring six meticulously engineered layers, this PCB provides an optimal balance between complexity and reliability, making it an ideal choice for high-performance devices. One of the standout characteristics of this product is its use of blind via technology, specifically blind hole vias, which enhances circuit density and optimizes space utilization without compromising signal integrity.
The implementation of blind vias in this 6 layer PCB allows for connections between inner layers and outer layers without penetrating the entire board. This results in a more compact design and improved electrical performance. Blind via PCB technology is particularly beneficial in multi-layer boards where space is at a premium and high-speed signal routing is required. By reducing via stubs and minimizing signal reflection, blind vias contribute to superior signal quality and overall device efficiency.
Constructed using HIGH TG FR4 material, this 6 layer PCB offers exceptional thermal stability and mechanical strength. The high glass transition temperature (TG) of the FR4 substrate ensures that the board can withstand elevated temperatures during soldering and operation, making it suitable for applications that involve harsh thermal environments. The use of HIGH TG FR4 enhances the durability and longevity of the PCB, reducing the risk of warping, delamination, or other thermal-induced failures.
To further support high-density designs, the PCB features BGA pads with an 8MIL pitch, facilitating precise and reliable ball grid array component placement. This fine pitch capability enables the integration of advanced microelectronic components, supporting compact and complex circuit layouts. The precision of the BGA pads ensures robust solder joints, which is critical for maintaining electrical connectivity and mechanical stability throughout the product’s lifecycle.
The solder mask color of this 6 layer PCB is green, a classic choice that offers excellent contrast for component placement and inspection. The green solder mask not only enhances the visual appeal of the board but also provides a protective layer that prevents oxidation and short circuits. It improves the overall durability of the PCB by shielding the copper traces from environmental contaminants and mechanical abrasion.
Quality assurance is paramount in the manufacture of this 6 layer PCB. Every board undergoes a thorough 100% electrical test to guarantee flawless performance and compliance with stringent industry standards. This comprehensive testing process verifies the integrity of all electrical connections, detects any potential short circuits or open circuits, and ensures that the PCB meets the specified design parameters. Customers can have full confidence in the reliability and consistency of each product delivered.
In summary, our 6 layer PCB with blind hole vias combines cutting-edge blind via PCB technology, HIGH TG FR4 material, and precise 8MIL BGA pads to deliver a robust and high-performance circuit solution. The green solder mask adds both protection and aesthetic appeal, while the exhaustive 100% electrical testing ensures every board performs perfectly. This product is ideally suited for complex electronic devices requiring high density, thermal resilience, and exceptional signal integrity.
Whether you are developing advanced communication equipment, high-speed computing devices, or intricate control systems, this 6 layer blind via PCB offers the reliability and precision you need. Trust in our expertise and high-quality manufacturing standards to provide a PCB that supports your innovation and elevates your product’s performance.
The 6 layer PCB product is an advanced multilayer PCB designed to meet the rigorous demands of modern electronic applications. Featuring a robust FR4 TG170 substrate, this PCB offers a high glass transition temperature (HIGH TG FR4), ensuring excellent thermal stability and reliability in high-performance environments. The multilayer construction allows for complex circuit designs and enhanced electrical performance, making it ideal for applications requiring intricate signal routing and high-density interconnections.
One of the distinguishing features of this 6 layer PCB is its dual solder mask color options: blue solder mask and green solder mask. These colors not only provide excellent protection against oxidation and solder bridging but also enhance the aesthetic appeal and ease of inspection during assembly. The solder mask is carefully applied to maintain precise clearances, supporting a minimum trace spacing of 4 mil, which is critical for high-density circuit layouts and minimizing signal interference.
The PCB incorporates blind hole vias, a sophisticated via type that connects outer layers to inner layers without passing through the entire board. This design choice optimizes board space, reduces parasitic capacitance, and improves signal integrity, which is crucial in high-speed and high-frequency applications. Blind hole vias also contribute to a more compact and lightweight PCB, making it suitable for modern electronic devices where size and weight are critical factors.
Moreover, the 6 layer PCB product complies fully with RoHS standards, ensuring it is environmentally friendly and free from hazardous substances. This compliance makes the PCB suitable for use in consumer electronics, medical devices, automotive systems, and other industries committed to sustainable manufacturing practices.
Typical application occasions for this multilayer PCB include telecommunications equipment, industrial control systems, aerospace electronics, and advanced computing devices. In these scenarios, the combination of FR4 TG170 material, HIGH TG FR4 thermal properties, blind hole vias, and precise trace spacing guarantees reliable performance under demanding conditions such as elevated temperatures, mechanical stress, and complex signal environments.
In summary, this 6 layer multilayer PCB with blue and green solder mask options, blind hole vias, RoHS compliance, and a minimum trace spacing of 4 mil is perfectly suited for sophisticated electronic designs requiring durability, precision, and environmental responsibility. Its advanced features make it an excellent choice for engineers and manufacturers aiming to deliver high-quality, high-performance electronic products across a variety of industries.
Our 6 layer PCB product offers advanced customization services to meet your specific requirements. Featuring a BGA pitch of 8MIL, this PCB is designed for high-density interconnect applications, making it an ideal choice for HDI PCB designs. We use copper thickness ranging from 18 to 105um to ensure optimal electrical performance and durability.
The minimum hole size is 0.2MM, allowing for precise drilling and the creation of blind via PCB structures that enhance connectivity without increasing board size. Each board undergoes a rigorous 100% electrical test to guarantee flawless functionality and reliability.
Whether you need a complex HDI PCB or a standard 6 layer PCB with blind vias, our product customization services are tailored to deliver exceptional quality and performance for your electronic projects.
Our 6 layer PCB product is supported by a dedicated technical support team ready to assist you with any inquiries or issues related to design, manufacturing, and application. We offer comprehensive services including design review, signal integrity analysis, and thermal management to ensure optimal performance of your multilayer PCB.
We provide detailed documentation and guidelines to help you understand the specifications and capabilities of your 6 layer PCB. Our team is equipped to assist with troubleshooting, customization requests, and integration support to meet your specific project requirements.
Additionally, we offer post-production services such as testing, quality assurance, and certification to guarantee the reliability and durability of your PCB. Our commitment is to deliver high-quality products along with exceptional technical support to facilitate seamless project execution from prototype to mass production.
For ongoing support, we provide firmware and software updates, as well as consultation services to optimize your PCB design and application. Our goal is to ensure your complete satisfaction and success with our 6 layer PCB solutions.
Product Packaging:
The 6 layer PCBs are carefully packaged to ensure maximum protection during transit. Each PCB is individually wrapped in anti-static bubble wrap to prevent any electrostatic discharge damage. The wrapped boards are then placed in a sturdy, custom-sized cardboard box with foam inserts to avoid any movement and mechanical damage.
Multiple boxes are consolidated into a larger shipping carton, which is sealed securely with strong packing tape. All packages are labeled clearly with handling instructions such as "Fragile" and "Handle with Care" to ensure careful handling throughout the shipping process.
Shipping:
We offer worldwide shipping for our 6 layer PCBs using reliable courier services. Shipping options include standard, expedited, and express delivery, depending on customer requirements. Each shipment is tracked and insured to provide peace of mind.
Before dispatch, all orders undergo a final quality inspection and are accompanied by the necessary documentation, including the packing list and invoice. Customers receive a tracking number once the package is shipped, allowing them to monitor the delivery status in real-time.
Q1: What are the advantages of a 6 layer PCB compared to a 4 layer PCB?
A 6 layer PCB offers improved signal integrity, better electromagnetic interference (EMI) shielding, and more routing space for complex circuits compared to a 4 layer PCB. This makes it ideal for high-speed and high-density applications.
Q2: What materials are used in the construction of the 6 layer PCB?
Our 6 layer PCBs are typically made using high-quality FR4 material, which provides excellent mechanical strength and electrical insulation. Other materials can be used upon request for specialized applications.
Q3: What is the typical thickness of a 6 layer PCB?
The standard thickness for a 6 layer PCB is 1.6mm, but we can customize the thickness from 0.8mm to 3.0mm depending on your design requirements.
Q4: What is the minimum trace width and spacing available for the 6 layer PCB?
Our 6 layer PCBs support a minimum trace width and spacing of 4 mil (0.1mm), allowing for fine pitch components and high-density circuit designs.
Q5: Can the 6 layer PCB support both through-hole and surface-mount components?
Yes, the 6 layer PCB is compatible with both through-hole and surface-mount technology (SMT), providing flexibility for various assembly processes.
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