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Home > products > PCB Assembly > pcb assembly low volume pcb assembly surface mount electonics pcb components assembly double sided pcb SMT and DIP
pcb assembly  low volume pcb assembly  surface mount  electonics pcb components assembly double sided pcb SMT and DIP

pcb assembly low volume pcb assembly surface mount electonics pcb components assembly double sided pcb SMT and DIP

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL

Model Number: HSF168

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: caton

Delivery Time: 7-10work days

Payment Terms: T/T, Western Union,paypal

Supply Ability: 50000pcs/month

Get Best Price
Highlight:
Material:
FR4/Polyamide
Layer:
4+2
Cooper:
1/1oz
Mask:
Yellow+green
Surface Finishing:
Immersion Gold, HASL, OSP, Chermical Gold, OSP/ENIG
Board Thickness:
1.6/0.2mm
Type:
Electronic Board, FPC, Dual Sides,Single Sided Flexible Printed Circuit Board/fpc/flexible Pcb Supplier,50pin
Application:
Consume Electronics, LCD Display, Test Cable, Electronic Product
Sold Mask Color:
Green/black/white/red/blue/yellow
Solder Mask:
Yellow PI Film, White, Black, Green,Red
Material:
FR4/Polyamide
Layer:
4+2
Cooper:
1/1oz
Mask:
Yellow+green
Surface Finishing:
Immersion Gold, HASL, OSP, Chermical Gold, OSP/ENIG
Board Thickness:
1.6/0.2mm
Type:
Electronic Board, FPC, Dual Sides,Single Sided Flexible Printed Circuit Board/fpc/flexible Pcb Supplier,50pin
Application:
Consume Electronics, LCD Display, Test Cable, Electronic Product
Sold Mask Color:
Green/black/white/red/blue/yellow
Solder Mask:
Yellow PI Film, White, Black, Green,Red
pcb assembly low volume pcb assembly surface mount electonics pcb components assembly double sided pcb SMT and DIP

pcb assembly  low volume pcb assembly  surface mount  electonics pcb components assembly double sided pcb SMT and DIP 0

 

Process Capability And Checking Parameters(Rigid Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times
Process Capability - Technical Parameters(FPC)
Content Common Special Surface treatment Thickness
Minimum line width 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um
Minimum line spacing 0.07mm 0.05mm
Minimum Drilling aperture Φ 0.15mm Φ 0.1mm
Aperture Tolerance ±0.1mm ±0.05mm Chemical immersion gold Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (double panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) 610*1650mm Electroplated hard gold Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance ±10% Electroplated pure tin Sn:3-7um
Maximum production layer 12L
Thickness To Diameter Ratio 2:1(Minimum aperture 0.1mm)
5:1(Minimum aperture 0.2mm) Anti-oxidation  
8:1(Minimum aperture 0.3mm)
Monthly production capacity/m² 16000 m²
 
Material
Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz)
Constantan
Silver Paste
Copper Ink
Adhesive Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film PI(0.5mil,1mil,2mil)(Yellow, White, Black)
PET(1mil,2mil)
Solder mask (green, yellow, black...)
Glue 3M467,3M468,3M9077,TESA8853...
Reinforcement Type PI,FR4,PET,Steel,Aluminum...

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