Product Details
Place of Origin: china
Brand Name: hengsheng
Certification: UL, ROHS,SGS,ISO9001
Model Number: HSF168
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: USD 0.1-5/pcs
Packaging Details: 25kgs/carton, vacuumed packing
Delivery Time: 7-10working days
Payment Terms: T/T, Western Union,paypal
Supply Ability: 100000pcs per month
Material: |
FR4 |
Layer: |
4 |
Cooper: |
1/1oz |
Mask: |
Yellow+green |
Surface Finishing: |
Immersion Gold, HASL, OSP, Chermical Gold, OSP/ENIG |
Board Thickness: |
1.6/0.2mm |
Type: |
Electronic Board, FPC, Dual Sides,Single Sided Flexible Printed Circuit Board/fpc/flexible Pcb Supplier,50pin |
Application: |
Consume Electronics, LCD Display, Test Cable,blue Tooth, Electronic Product |
Sold Mask Color: |
Green/black/white/red/blue/yellow |
Solder Mask: |
Yellow PI Film, White, Black, Green,Red |
Material: |
FR4 |
Layer: |
4 |
Cooper: |
1/1oz |
Mask: |
Yellow+green |
Surface Finishing: |
Immersion Gold, HASL, OSP, Chermical Gold, OSP/ENIG |
Board Thickness: |
1.6/0.2mm |
Type: |
Electronic Board, FPC, Dual Sides,Single Sided Flexible Printed Circuit Board/fpc/flexible Pcb Supplier,50pin |
Application: |
Consume Electronics, LCD Display, Test Cable,blue Tooth, Electronic Product |
Sold Mask Color: |
Green/black/white/red/blue/yellow |
Solder Mask: |
Yellow PI Film, White, Black, Green,Red |
| Process Capability And Checking Parameters(Hard Board) | |||||||
| NO | ITEM | Technical Capabilities | |||||
| 1 | Layers | 1-38L | |||||
| 2 | Max.Board Size | 1200*610mm | |||||
| 48"*24" | |||||||
| 3 | Finished Board Thickness | 0.2mm--10.0mm | |||||
| 0.008"--0.4" | |||||||
| 4 | Finished Copper Thickness | 17um-420um | |||||
| 0.5OZ--12OZ | |||||||
| 5 | Min.Trace Width/Space | 0.075mm/0.065mm | |||||
| 0.003"/0.0026" | |||||||
| 6 | Min.Hole Size | 0.15mm | |||||
| 0.006" | |||||||
| 7 | Hole Dim. Tolerance(PTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 8 | Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 9 | Drill Location Tolerance | ±0.05mm | |||||
| ±0.002" | |||||||
| 10 | V-Cut Degrees | 20-90 ºC | |||||
| 20DEG-90DEG | |||||||
| 11 | Min.V-Cut PCB Thickness | 0.4mm | |||||
| 0.016" | |||||||
| 12 | N/C Routing Tolerance | ±0.1mm | |||||
| ±0.004" | |||||||
| 13 | Min.Blind/Buried Via | 0.15mm | |||||
| 0.06" | |||||||
| 14 | Plug Hole Size | 0.2mm--0.6mm | |||||
| 0.008"--0.024" | |||||||
| 15 | Min.BGA PAD | 0.2mm | |||||
| 0.008" | |||||||
| 16 | Materials | FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB | |||||
| 17 | Surface Finish | HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F | |||||
| 18 | Warp & Twist | ≤0.75% | |||||
| 19 | Electrical Testing | 50--300V | |||||
| 20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% | |||||
| 21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles | |||||
| 22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm | |||||
| 23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times | |||||
| Process Capability - Technical Parameters(FPC) | |||||
| Content | Common | Special | Surface treatment | Thickness | |
| Minimum line width | 0.07mm | 0.05mm | Electroplated nickel gold | Ni:3-9um;Au:0.03-0.1um | |
| Minimum line spacing | 0.07mm | 0.05mm | |||
| Minimum Drilling aperture | Φ 0.15mm | Φ 0.1mm | |||
| Aperture Tolerance | ±0.1mm | ±0.05mm | Chemical immersion gold | Ni:3-5um;Au:0.03-0.1um | |
| Maximum imposition size (single panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | |||
| Maximum imposition size (double panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | |||
| Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) | 610*1650mm | Electroplated hard gold | Ni:2-9um;Au:0.1-0.3um | ||
| Finished board impedance tolerance | ±10% | Electroplated pure tin | Sn:3-7um | ||
| Maximum production layer | 12L | ||||
| Thickness To Diameter Ratio | 2:1(Minimum aperture 0.1mm) | ||||
| 5:1(Minimum aperture 0.2mm) | Anti-oxidation | ||||
| 8:1(Minimum aperture 0.3mm) | |||||
| Monthly production capacity/m² | 16000 m² | ||||
| Material | |||||
| Substrate Material | PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) | ||||
| Conductive Medium | Copper foil(1/3oz,1/2oz,1oz,2oz) | ||||
| Constantan | |||||
| Silver Paste | |||||
| Copper Ink | |||||
| Adhesive | Epoxy resin, Acrylic, Adhesion | ||||
| Solder Mask / Protective Film | PI(0.5mil,1mil,2mil)(Yellow, White, Black) | ||||
| PET(1mil,2mil) | |||||
| Solder mask (green, yellow, black...) | |||||
| Glue | 3M467,3M468,3M9077,TESA8853... | ||||
| Reinforcement Type | PI,FR4,PET,Steel,Aluminum... | ||||
FAQ
Q1. What information do i need for PCB quotation?
A: Gerber file and technical requirements. Such as the material of the PCB, thickness, copper surface, the colour of mask and silkscreen, etc.)
Q2. What file formats are accepted for PCB production?
A: Gerber file: CAM350 PCB files: Protel 99SE, PADS, CAD, Altium Designer.
Q3. Are my files safe?
A: Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole
process.. All documents from customers are never shared with any third parties.
Q4. What is the MOQ?
A: Our company does not have the minimum order quantity. We are able to flexibly handle small batches and mass production.
Q5. How much for the shipping cost?
A: The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.
