Shenzhen Hengxunda Circuit Technology Co.,LTD
products
products
Home > products > Multilayer PCB > pcb manufacturing 10 layer with plug hole pcb FR4 tg170 material ENIG surface BGA multilayer circuit boards pcb design

pcb manufacturing 10 layer with plug hole pcb FR4 tg170 material ENIG surface BGA multilayer circuit boards pcb design

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL,TS16949,ROHS, ISO9001

Model Number: HS40152

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: USD 0.1-5/pcs

Packaging Details: 25kgs/carton, vacuumed packing

Delivery Time: 7-10work days

Payment Terms: T/T, Western Union,paypal

Supply Ability: 100000pcs per month

Get Best Price
Highlight:
Material:
FR-4
Board Thickness:
2.0mm
Base Copper:
50um(1.5oz)
Min. Line Space:
0.15mm
Min. Line Width:
0.15mm
Min. Hole Size:
0.30mm
Surface:
ENIG
Type:
Industrial Control
Material:
FR-4
Board Thickness:
2.0mm
Base Copper:
50um(1.5oz)
Min. Line Space:
0.15mm
Min. Line Width:
0.15mm
Min. Hole Size:
0.30mm
Surface:
ENIG
Type:
Industrial Control
pcb manufacturing 10 layer with plug hole pcb FR4 tg170 material ENIG surface BGA multilayer circuit boards pcb design

 

Process Capability And Checking Parameters(Rigid Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times