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pcb manufacturing multilayer circuit boards pcb design 8 layer pcb with gold fingers communication equipment switch pcb

pcb manufacturing multilayer circuit boards pcb design 8 layer pcb with gold fingers communication equipment switch pcb

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL,TS16949,ROHS, ISO9001

Model Number: HS40152

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: caton

Delivery Time: 7-10work days

Payment Terms: T/T, Western Union,paypal

Supply Ability: 50000pcs/month

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Highlight:
Material:
FR-4
Board Thickness:
2.0mm
Base Copper:
50um(1.5oz)
Min. Line Space:
0.15mm
Min. Line Width:
0.15mm
Min. Hole Size:
0.30mm
Surface:
ENIG
Type:
Industrial Control
Material:
FR-4
Board Thickness:
2.0mm
Base Copper:
50um(1.5oz)
Min. Line Space:
0.15mm
Min. Line Width:
0.15mm
Min. Hole Size:
0.30mm
Surface:
ENIG
Type:
Industrial Control
pcb manufacturing multilayer circuit boards pcb design 8 layer pcb with gold fingers communication equipment switch pcb

pcb manufacturing multilayer circuit boards pcb design 8 layer pcb with gold fingers communication equipment switch pcb 0

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times

 

Q: How to design my PCB?

A:Firstly, determine the layer and size of the pcb. Secondly, the package for placing the components and the package for placing the components. Thirdly, according to the schematic diagram of the circuit board, the Place/interactive Routing menu can be directly used for manual routing. And the lastly, modify the circuit board, save or print files.

 

Q: I have no gerber file, other file is it ok?

A: Of course, you can send other files to us, for exemple: CAD file, DXF file and Aligo, etc.

 

Q: I have no any pcb files, how can i do?

A: When you don’t have any PCB files, you can send us the schematic diagram of the PCB, and we can design your PCB for you