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Home > products > Multilayer PCB > 6layer pcb with buried blind hole multilayer pcb manufacturing multilayer circuit board pcb prototype fabrication
6layer pcb with buried blind hole multilayer pcb manufacturing multilayer circuit board pcb prototype fabrication

6layer pcb with buried blind hole multilayer pcb manufacturing multilayer circuit board pcb prototype fabrication

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL,TS16949,ROHS, ISO9001

Model Number: HS60255

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: caton

Delivery Time: 5-7working days

Payment Terms: T/T, Western Union,paypal

Supply Ability: 50000pcs/month

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Highlight:
Materail:
FR-4
Board Thickness:
1.6mm
Basse Copper:
50um
Min. Line Space:
0.15mm
Min.line Width:
0.15nn
Min. Hole Size:
0.25mm
Solder Mask:
Black
Surface:
Gold Platting
Materail:
FR-4
Board Thickness:
1.6mm
Basse Copper:
50um
Min. Line Space:
0.15mm
Min.line Width:
0.15nn
Min. Hole Size:
0.25mm
Solder Mask:
Black
Surface:
Gold Platting
6layer pcb with buried blind hole multilayer pcb manufacturing multilayer circuit board pcb prototype fabrication

6layer pcb with buried blind hole multilayer pcb manufacturing multilayer circuit board pcb prototype fabrication 0

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting,ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times