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Multilayer PCB

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Multilayer PCB

Multilayer PCB

Large Image :  Multilayer PCB

Product Details:

Multilayer PCB

Description

Material used
FR4 – Laminates HTC (High Thermal Conductivity) – Teflon – FR4 ceramics
FR4 Tg Mid, High – FR4 low Er and low Lf – Laminates Halogen Free
Thickness of base PCB (including copper when> 0.8mm)
Standard 1,6 mm – To request from 0,5 to 5 mm
Prepreg
To request
Thickness of base copper
Standard (18um, 35um, 70um), Advanced (9um, 12um, 105um, 140um, 170um, 210um)
Drilling
Mechanics (minimum drill d=0,20mm), mechanical controlled height
Laser via (max Ø laser via 0,1mmm – aspect ratio 1:1), blind and buried, for lay up sequential (HDI)
Surface Finishes
Passivated Copper OSP – HAL Lead Free or Sn/Pb – Electrolytic gold
Immersion Gold (ENIG) – Silver or Immersion Tin
Max. number of layer: 24

Contact Details
Shenzhen Hengxunda Circuit Technology Co.,LTD

Contact Person: Ms. angelina

Tel: 0086-15889447462

Fax: 86-755-23061612

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