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Multilayer PCB

Multilayer PCB

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Multilayer PCB

Material used
FR4 – Laminates HTC (High Thermal Conductivity) – Teflon – FR4 ceramics
FR4 Tg Mid, High – FR4 low Er and low Lf – Laminates Halogen Free
Thickness of base PCB (including copper when> 0.8mm)
Standard 1,6 mm – To request from 0,5 to 5 mm
To request
Thickness of base copper
Standard (18um, 35um, 70um), Advanced (9um, 12um, 105um, 140um, 170um, 210um)
Mechanics (minimum drill d=0,20mm), mechanical controlled height
Laser via (max Ø laser via 0,1mmm – aspect ratio 1:1), blind and buried, for lay up sequential (HDI)
Surface Finishes
Passivated Copper OSP – HAL Lead Free or Sn/Pb – Electrolytic gold
Immersion Gold (ENIG) – Silver or Immersion Tin
Max. number of layer: 24


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