Product Details
Place of Origin: china
Brand Name: hengsheng
Certification: UL, ROHS,SGS,ISO9001
Model Number: HS4015
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: USD 0.1-5/pcs
Packaging Details: 25kgs/carton, vacuumed packing
Delivery Time: 7-10 days
Payment Terms: T/T, Western Union,paypal
Supply Ability: 100000pcs per month
Board Thickness: |
1.6mm |
Copper Thickness: |
1oz |
Impedance Control: |
Yes |
Layer: |
4 |
Material: |
FR4 |
Min Hole Size: |
0.2mm |
Min Line Spacing: |
0.1mm |
Min Line Width: |
0.1mm |
Packaging: |
Vacuum Packaging |
Silkscreen Color: |
White |
Solder Mask Color: |
Green |
Surface Finish: |
AU=0.05um,Ni=3um |
Testing: |
Flying Probe |
Board Thickness: |
1.6mm |
Copper Thickness: |
1oz |
Impedance Control: |
Yes |
Layer: |
4 |
Material: |
FR4 |
Min Hole Size: |
0.2mm |
Min Line Spacing: |
0.1mm |
Min Line Width: |
0.1mm |
Packaging: |
Vacuum Packaging |
Silkscreen Color: |
White |
Solder Mask Color: |
Green |
Surface Finish: |
AU=0.05um,Ni=3um |
Testing: |
Flying Probe |
| Process Capability And Checking Parameters(Rigid Board) | |||||||
| NO | ITEM | Technical Capabilities | |||||
| 1 | Layers | 1-38L | |||||
| 2 | Max.Board Size | 1200*610mm | |||||
| 48"*24" | |||||||
| 3 | Finished Board Thickness | 0.2mm--10.0mm | |||||
| 0.008"--0.4" | |||||||
| 4 | Finished Copper Thickness | 17um-420um | |||||
| 0.5OZ--12OZ | |||||||
| 5 | Min.Trace Width/Space | 0.075mm/0.065mm | |||||
| 0.003"/0.0026" | |||||||
| 6 | Min.Hole Size | 0.15mm | |||||
| 0.006" | |||||||
| 7 | Hole Dim. Tolerance(PTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 8 | Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 9 | Drill Location Tolerance | ±0.05mm | |||||
| ±0.002" | |||||||
| 10 | V-Cut Degrees | 20-90 ºC | |||||
| 20DEG-90DEG | |||||||
| 11 | Min.V-Cut PCB Thickness | 0.4mm | |||||
| 0.016" | |||||||
| 12 | N/C Routing Tolerance | ±0.1mm | |||||
| ±0.004" | |||||||
| 13 | Min.Blind/Buried Via | 0.15mm | |||||
| 0.06" | |||||||
| 14 | Plug Hole Size | 0.2mm--0.6mm | |||||
| 0.008"--0.024" | |||||||
| 15 | Min.BGA PAD | 0.2mm | |||||
| 0.008" | |||||||
| 16 | Materials | FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB | |||||
| 17 | Surface Finish | HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F | |||||
| 18 | Warp & Twist | ≤0.75% | |||||
| 19 | Electrical Testing | 50--300V | |||||
| 20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% | |||||
| 21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles | |||||
| 22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm | |||||
| 23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times | |||||
