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8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control

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8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control

China 8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control Supplier
8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control Supplier 8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control Supplier 8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control Supplier

Large Image :  8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control

Product Details:

Place of Origin: china
Brand Name: hengsheng
Certification: UL
Model Number: HS6025

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: 0.1usd
Packaging Details: caton
Delivery Time: 7-10work days
Payment Terms: T/T, Western Union,paypal
Supply Ability: 50000pcs/month
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Detailed Product Description
Material: FR-4 Layer: 8
Cooper: 1/1oz Mask: Green
Finished: Gold Platting

8layer pcb fr4 material green mask enig impedance pcb multi layer pcb printed circuit board used for Industrial Control

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times

Contact Details
Hascend Electronic (HK) Limited

Contact Person: Ms. angelina

Tel: 852--30697751

Fax: 852--30697752

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