Product Details
Place of Origin: china
Brand Name: hengsheng
Certification: UL,TS16949,ROHS, ISO9001
Model Number: HSG6046
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: USD 0.1-5/pcs
Packaging Details: 25kgs/carton, vacuumed packing
Delivery Time: 7-10working days
Payment Terms: T/T, Western Union,paypal
Supply Ability: 100000pcs per month
Base Material: |
FR-4 |
Board Thickness: |
1.6mm |
Surface Finishing: |
Immerson Gold |
Min. Line Spacing: |
4mil |
Min. Line Width: |
4mil |
Min. Hole Size: |
0.25mm |
Copper Thickness: |
H/Hoz |
Test: |
E-test/Fixture Text |
Base Material: |
FR-4 |
Board Thickness: |
1.6mm |
Surface Finishing: |
Immerson Gold |
Min. Line Spacing: |
4mil |
Min. Line Width: |
4mil |
Min. Hole Size: |
0.25mm |
Copper Thickness: |
H/Hoz |
Test: |
E-test/Fixture Text |
Process Capability And Checking Parameters(Hard Board) | |||||||
NO | ITEM | Technical Capabilities | |||||
1 | Layers | 1-38L | |||||
2 | Max.Board Size | 1200*610mm | |||||
48"*24" | |||||||
3 | Finished Board Thickness | 0.2mm--10.0mm | |||||
0.008"--0.4" | |||||||
4 | Finished Copper Thickness | 17um-420um | |||||
0.5OZ--12OZ | |||||||
5 | Min.Trace Width/Space | 0.075mm/0.065mm | |||||
0.003"/0.0026" | |||||||
6 | Min.Hole Size | 0.15mm | |||||
0.006" | |||||||
7 | Hole Dim. Tolerance(PTH) | ±0.05mm | |||||
±0.002" | |||||||
8 | Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||
±0.002" | |||||||
9 | Drill Location Tolerance | ±0.05mm | |||||
±0.002" | |||||||
10 | V-Cut Degrees | 20-90 ºC | |||||
20DEG-90DEG | |||||||
11 | Min.V-Cut PCB Thickness | 0.4mm | |||||
0.016" | |||||||
12 | N/C Routing Tolerance | ±0.1mm | |||||
±0.004" | |||||||
13 | Min.Blind/Buried Via | 0.15mm | |||||
0.06" | |||||||
14 | Plug Hole Size | 0.2mm--0.6mm | |||||
0.008"--0.024" | |||||||
15 | Min.BGA PAD | 0.2mm | |||||
0.008" | |||||||
16 | Materials | FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB | |||||
17 | Surface Finish | HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F | |||||
18 | Warp & Twist | ≤0.75% | |||||
19 | Electrical Testing | 50--300V | |||||
20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% | |||||
21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles | |||||
22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm | |||||
23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times | |||||
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