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Home > products > Double Sided PCB > FPCB Mobile phone cable flexible fpc custom flex pcb PET material flex cable fpc manufacturer 3m back adhesive
FPCB Mobile phone cable flexible fpc custom flex pcb PET material flex cable fpc manufacturer 3m back adhesive

FPCB Mobile phone cable flexible fpc custom flex pcb PET material flex cable fpc manufacturer 3m back adhesive

Product Details

Place of Origin: China

Brand Name: hengsheng

Certification: ISO 9001,UL,CE,ROHS

Model Number: HSG5046

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: CARTON

Delivery Time: 7-10working days

Payment Terms: T/T or PAYPAL, Western Union

Supply Ability: 50000pcs/month

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Highlight:
Base Material:
Rolled Copper
Copper Thickness:
1OZ
Board Thickness:
0.12mm
Min. Hole Size:
0.2MM
Min. Line Width:
0.2MM
Min. Line Spacing:
0.3MM
Surface Finishing:
ENIG
Solder Mask:
Yellow PI Film
Base Material:
Rolled Copper
Copper Thickness:
1OZ
Board Thickness:
0.12mm
Min. Hole Size:
0.2MM
Min. Line Width:
0.2MM
Min. Line Spacing:
0.3MM
Surface Finishing:
ENIG
Solder Mask:
Yellow PI Film
FPCB Mobile phone cable flexible fpc custom flex pcb PET material flex cable fpc manufacturer 3m back adhesive

FPCB Mobile phone cable flexible fpc custom flex pcb PET material flex cable fpc manufacturer 3m back adhesive 0

 

Process Capability - Technical Parameters(FPC)
Content Common Special Surface treatment Thickness
Minimum line width 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um
Minimum line spacing 0.07mm 0.05mm
Minimum Drilling aperture Φ 0.15mm Φ 0.1mm
Aperture Tolerance ±0.1mm ±0.05mm Chemical immersion gold Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (double panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) 610*1650mm Electroplated hard gold Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance ±10% Electroplated pure tin Sn:3-7um
Maximum production layer 12L
Thickness To Diameter Ratio 2:1(Minimum aperture 0.1mm)
5:1(Minimum aperture 0.2mm) Anti-oxidation  
8:1(Minimum aperture 0.3mm)
Monthly production capacity/m² 16000 m²
 
Material
Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz)
Constantan
Silver Paste
Copper Ink
Adhesive Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film PI(0.5mil,1mil,2mil)(Yellow, White, Black)
PET(1mil,2mil)
Solder mask (green, yellow, black...)
Glue 3M467,3M468,3M9077,TESA8853...
Reinforcement Type PI,FR4,PET,Steel,Aluminum...