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Home > products > Multilayer PCB > multilayer pcb fabrication process 10 layer pcb with blue glue multilayer pcb manufacturing pcb printed circuit board
multilayer pcb fabrication process 10 layer pcb with blue glue multilayer pcb manufacturing pcb printed circuit board

multilayer pcb fabrication process 10 layer pcb with blue glue multilayer pcb manufacturing pcb printed circuit board

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL,ISO9001,TS16949

Model Number: HSG5046

Payment & Shipping Terms

Minimum Order Quantity: 0

Price: 120

Packaging Details: caton

Payment Terms: L/C, T/T, Western Union

Supply Ability: 100000pcs

Get Best Price
Highlight:
Materail:
FR-4
Thickness:
1.6mm
Copper:
1oz
Surface:
Gold Platting+blue Glue
Materail:
FR-4
Thickness:
1.6mm
Copper:
1oz
Surface:
Gold Platting+blue Glue
multilayer pcb fabrication process 10 layer pcb with blue glue multilayer pcb manufacturing pcb printed circuit board

multilayer pcb fabrication process 10 layer pcb with blue glue multilayer pcb manufacturing pcb printed circuit board 0

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times