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Home > products > Multilayer PCB > pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing
pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing

pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL,TS16949,ROHS, ISO9001

Model Number: HS60252

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: caton

Delivery Time: 7-10work days

Payment Terms: TT/PAYPAL/Western Union

Supply Ability: 50000pcs/month

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Highlight:
Material:
FR-4
Board Thickness:
1.6mm
Min Line Space:
0.2mm
Min Line Width:
0.2mm
Min Hole Size:
0.3mm
Surface:
Gold Platting+blue Glue
Material:
FR-4
Board Thickness:
1.6mm
Min Line Space:
0.2mm
Min Line Width:
0.2mm
Min Hole Size:
0.3mm
Surface:
Gold Platting+blue Glue
pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing

pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing 0

 

Process Capability and Checking Parameters
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times