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circuit board assembly services low volume pcb assembly surface mount pcb electonics pcb components assembly

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL, ROHS,SGS,ISO9001

Model Number: HS4015

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd per pcs

Packaging Details: 25kgs/carton, vacuumed packing

Delivery Time: 7-10work days

Payment Terms: T/T, Western Union,paypal

Supply Ability: 10000pcs

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Board Thickness:
1.6mm
Copper Thickness:
1oz
Lead Time:
7-10 Days
Min. Annular Ring:
0.2mm
Min. Hole Size:
0.2mm
Min. Line Spacing:
0.1mm
Min. Line Width:
0.1mm
PCB Layer:
2-layer
Product Name:
PCB Assembly
Silkscreen Color:
White
Solder Mask Color:
Green
Surface Finish:
HASL
Warranty:
1 Year
Board Thickness:
1.6mm
Copper Thickness:
1oz
Lead Time:
7-10 Days
Min. Annular Ring:
0.2mm
Min. Hole Size:
0.2mm
Min. Line Spacing:
0.1mm
Min. Line Width:
0.1mm
PCB Layer:
2-layer
Product Name:
PCB Assembly
Silkscreen Color:
White
Solder Mask Color:
Green
Surface Finish:
HASL
Warranty:
1 Year
circuit board assembly services low volume pcb assembly surface mount pcb electonics pcb components assembly

 

Process Capability - Technical Parameters(FPC)
Content Common Special Surface treatment Thickness
Minimum line width 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um
Minimum line spacing 0.07mm 0.05mm
Minimum Drilling aperture Φ 0.15mm Φ 0.1mm
Aperture Tolerance ±0.1mm ±0.05mm Chemical immersion gold Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (double panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) 610*1650mm Electroplated hard gold Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance ±10% Electroplated pure tin Sn:3-7um
Maximum production layer 12L
Thickness To Diameter Ratio 2:1(Minimum aperture 0.1mm)
5:1(Minimum aperture 0.2mm) Anti-oxidation  
8:1(Minimum aperture 0.3mm)
Monthly production capacity/m² 16000 m²
 
Material
Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz)
Constantan
Silver Paste
Copper Ink
Adhesive Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film PI(0.5mil,1mil,2mil)(Yellow, White, Black)
PET(1mil,2mil)
Solder mask (green, yellow, black...)
Glue 3M467,3M468,3M9077,TESA8853...
Reinforcement Type PI,FR4,PET,Steel,Aluminum...

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