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Home > products > Main/Mother Board PCB > pcb supplier 12layer pcb factory multilayer pcb manufacturer impedance pcb board electronic printed circuit board
pcb supplier 12layer pcb  factory multilayer pcb manufacturer impedance pcb board electronic  printed circuit board

pcb supplier 12layer pcb factory multilayer pcb manufacturer impedance pcb board electronic printed circuit board

Product Details

Place of Origin: china

Brand Name: hengsheng

Certification: UL

Model Number: HSF168

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: 0.1usd

Packaging Details: caton

Delivery Time: 7-10work days

Payment Terms: T/T, Western Union,paypal

Supply Ability: 50000pcs/month

Get Best Price
Highlight:
Type:
Customized Electronics
Base Material:
FR-4
Board Thickness:
1.6mm
Copper Thickness:
35um
Surface Finishing:
Immersion Gold
Min. Line Spacing:
3mil(0.075mm)
Min. Line Width:
3mil(0.075mm)
Min. Hole Size:
0.2mm
Color:
Green, Blue, Yellow
Test:
E-test/Fixture Test
Type:
Customized Electronics
Base Material:
FR-4
Board Thickness:
1.6mm
Copper Thickness:
35um
Surface Finishing:
Immersion Gold
Min. Line Spacing:
3mil(0.075mm)
Min. Line Width:
3mil(0.075mm)
Min. Hole Size:
0.2mm
Color:
Green, Blue, Yellow
Test:
E-test/Fixture Test
pcb supplier 12layer pcb factory multilayer pcb manufacturer impedance pcb board electronic printed circuit board

pcb supplier 12layer pcb  factory multilayer pcb manufacturer impedance pcb board electronic  printed circuit board 0

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times
Process Capability - Technical Parameters(FPC)
Content Common Special Surface treatment Thickness
Minimum line width 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um
Minimum line spacing 0.07mm 0.05mm
Minimum Drilling aperture Φ 0.15mm Φ 0.1mm
Aperture Tolerance ±0.1mm ±0.05mm Chemical immersion gold Ni:3-5um;Au:0.03-0.1um
Maximum imposition size (single panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (double panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) 610*1650mm Electroplated hard gold Ni:2-9um;Au:0.1-0.3um
Finished board impedance tolerance ±10% Electroplated pure tin Sn:3-7um
Maximum production layer 12L
Thickness To Diameter Ratio 2:1(Minimum aperture 0.1mm)
5:1(Minimum aperture 0.2mm) Anti-oxidation  
8:1(Minimum aperture 0.3mm)
Monthly production capacity/m² 16000 m²
 
Material
Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz)
Constantan
Silver Paste
Copper Ink
Adhesive Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film PI(0.5mil,1mil,2mil)(Yellow, White, Black)
PET(1mil,2mil)
Solder mask (green, yellow, black...)
Glue 3M467,3M468,3M9077,TESA8853...
Reinforcement Type PI,FR4,PET,Steel,Aluminum...