Product Details
Place of Origin: china
Brand Name: hengsheng
Certification: UL
Model Number: HS6025
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: 0.1usd
Packaging Details: caton
Delivery Time: 5-7working days
Payment Terms: T/T, Western Union
Supply Ability: 100000pcs
Materail: |
FR-4 |
Thickness: |
1.6mm |
Copper: |
50um |
Surface: |
Gold Platting |
Solder: |
Blue,black,purple |
Min Hole: |
0.25mm |
Materail: |
FR-4 |
Thickness: |
1.6mm |
Copper: |
50um |
Surface: |
Gold Platting |
Solder: |
Blue,black,purple |
Min Hole: |
0.25mm |
Q: How to design my PCB?
A:Firstly, determine the layer and size of the pcb. Secondly, the package for placing the components and the package for placing the components. Thirdly, according to the schematic diagram of the circuit board, the Place/interactive Routing menu can be directly used for manual routing. And the lastly, modify the circuit board, save or print files.
Q: I have no gerber file, other file is it ok?
A: Of course, you can send other files to us, for exemple: CAD file, DXF file and Aligo, etc.
Q: I have no any pcb files, how can i do?
A: When you don’t have any PCB files, you can send us the schematic diagram of the PCB, and we can design your PCB for you
| Process Capability And Checking Parameters(Rigid PCB) | |||||||
| NO | ITEM | Technical Capabilities | |||||
| 1 | Layers | 1-38L | |||||
| 2 | Max.Board Size | 1200*610mm | |||||
| 48"*24" | |||||||
| 3 | Finished Board Thickness | 0.2mm--10.0mm | |||||
| 0.008"--0.4" | |||||||
| 4 | Finished Copper Thickness | 17um-420um | |||||
| 0.5OZ--12OZ | |||||||
| 5 | Min.Trace Width/Space | 0.075mm/0.065mm | |||||
| 0.003"/0.0026" | |||||||
| 6 | Min.Hole Size | 0.15mm | |||||
| 0.006" | |||||||
| 7 | Hole Dim. Tolerance(PTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 8 | Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||
| ±0.002" | |||||||
| 9 | Drill Location Tolerance | ±0.05mm | |||||
| ±0.002" | |||||||
| 10 | V-Cut Degrees | 20-90 ºC | |||||
| 20DEG-90DEG | |||||||
| 11 | Min.V-Cut PCB Thickness | 0.4mm | |||||
| 0.016" | |||||||
| 12 | N/C Routing Tolerance | ±0.1mm | |||||
| ±0.004" | |||||||
| 13 | Min.Blind/Buried Via | 0.15mm | |||||
| 0.06" | |||||||
| 14 | Plug Hole Size | 0.2mm--0.6mm | |||||
| 0.008"--0.024" | |||||||
| 15 | Min.BGA PAD | 0.2mm | |||||
| 0.008" | |||||||
| 16 | Materials | FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB | |||||
| 17 | Surface Finish | HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F | |||||
| 18 | Warp & Twist | ≤0.75% | |||||
| 19 | Electrical Testing | 50--300V | |||||
| 20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% | |||||
| 21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles | |||||
| 22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm | |||||
| 23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times | |||||
