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printed circuit board multilayer pcb production

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Multilayer PCB

Multilayer PCB Sample Introduction

printed circuit board multilayer pcb production

China printed circuit board multilayer pcb production Supplier
printed circuit board multilayer pcb production Supplier printed circuit board multilayer pcb production Supplier printed circuit board multilayer pcb production Supplier printed circuit board multilayer pcb production Supplier printed circuit board multilayer pcb production Supplier

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Product Details:

Brand Name: hengsheng
Model Number: HS4015

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: 0.1usd
Delivery Time: 7-10work days
Payment Terms: T/T, Western Union,paypal
Supply Ability: 10000pcs
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Detailed Product Description

Process Capability And Checking Parameters(Rigid Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times

Contact Details
Hascend Electronic (HK) Limited

Contact Person: Ms. angelina

Tel: 852--30697751

Fax: 852--30697752

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