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printed circuit board multilayer pcb 6layers pcb electronics mother board and main board pcb FR-4(TG170)

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Multilayer PCB

Multilayer PCB Sample Introduction

printed circuit board multilayer pcb 6layers pcb electronics mother board and main board pcb FR-4(TG170)

China printed circuit board multilayer pcb 6layers pcb electronics  mother board and main board pcb FR-4(TG170) Supplier

Large Image :  printed circuit board multilayer pcb 6layers pcb electronics mother board and main board pcb FR-4(TG170)

Product Details:

Certification: UL

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: 0.1usd
Packaging Details: carton
Delivery Time: 7-10work days
Payment Terms: T/T, Western Union,paypal
Supply Ability: 10000pcs
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Detailed Product Description

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times
               
               
Process Capability - Technical Parameters(FPC)    
Content Common Special Surface treatment Thickness    
Minimum line width 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um    
Minimum line spacing 0.07mm 0.05mm    
Minimum Drilling aperture Φ 0.15mm Φ 0.1mm    
Aperture Tolerance ±0.1mm ±0.05mm Chemical immersion gold Ni:3-5um;Au:0.03-0.1um    
Maximum imposition size (single panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)    
Maximum imposition size (double panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples)    
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) 610*1650mm Electroplated hard gold Ni:2-9um;Au:0.1-0.3um    
Finished board impedance tolerance ±10% Electroplated pure tin Sn:3-7um    
Maximum production layer 12L    
Thickness To Diameter Ratio 2:1(Minimum aperture 0.1mm)    
5:1(Minimum aperture 0.2mm) Anti-oxidation      
8:1(Minimum aperture 0.3mm)    
Monthly production capacity/m² 16000 m²    
     
Material    
Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)    
Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz)    
Constantan    
Silver Paste    
Copper Ink    
Adhesive Epoxy resin, Acrylic, Adhesion    
Solder Mask / Protective Film PI(0.5mil,1mil,2mil)(Yellow, White, Black)    
PET(1mil,2mil)    
Solder mask (green, yellow, black...)    
Glue 3M467,3M468,3M9077,TESA8853...    
Reinforcement Type PI,FR4,PET,Steel,Aluminum...    

Contact Details
Shenzhen Hengsheng Electronic Co., Ltd

Contact Person: Ms. angelina

Tel: 852--30697751

Fax: 852--30697752

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