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pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing

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Multilayer PCB

Multilayer PCB Sample Introduction

pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing

China pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing Supplier
pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing Supplier pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing Supplier pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing Supplier

Large Image :  pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing

Product Details:

Place of Origin: china
Brand Name: hengsheng
Certification: UL,TS16949,ROHS, ISO9001
Model Number: HS60252

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: 0.1usd
Packaging Details: caton
Delivery Time: 7-10work days
Payment Terms: TT/PAYPAL/Western Union
Supply Ability: 50000pcs/month
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Detailed Product Description
Material: FR-4 Board Thickness: 1.6mm
Min Line Space: 0.2mm Min Line Width: 0.2mm
Min Hole Size: 0.3mm Surface: Gold Platting+blue Glue

pcb samples 6layer pcb with gold platting FR4 tg150 material ENIG surface finished multilayer pcb manufacturing

 

Process Capability and Checking Parameters
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times

Contact Details
Shenzhen Hengxunda Circuit Technology Co.,LTD

Contact Person: Ms. angelina

Tel: 86--15889447462

Fax: 86-755-23061612

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