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pcb factory multilayer pcb manufacturer 12 layer circuit board FR4 material TG130 gold platting computer graphics pcb

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Good quality and good price, our long-term cooperative supplier.

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Multilayer PCB

Multilayer PCB Sample Introduction

pcb factory multilayer pcb manufacturer 12 layer circuit board FR4 material TG130 gold platting computer graphics pcb

China pcb factory multilayer pcb manufacturer 12 layer circuit board FR4 material TG130 gold platting computer graphics pcb Supplier
pcb factory multilayer pcb manufacturer 12 layer circuit board FR4 material TG130 gold platting computer graphics pcb Supplier pcb factory multilayer pcb manufacturer 12 layer circuit board FR4 material TG130 gold platting computer graphics pcb Supplier pcb factory multilayer pcb manufacturer 12 layer circuit board FR4 material TG130 gold platting computer graphics pcb Supplier

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Product Details:

Place of Origin: china
Brand Name: hengsheng
Certification: UL
Model Number: HS6025

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: 0.1usd
Packaging Details: caton
Delivery Time: 5-7working days
Payment Terms: T/T, Western Union
Supply Ability: 100000pcs
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Detailed Product Description
Materail: FR-4 Thickness: 1.6mm
Copper: 50um Surface: Gold Platting
Solder: Blue,black,purple Min Hole: 0.25mm

Q: How to design my PCB?

A:Firstly, determine the layer and size of the pcb. Secondly, the package for placing the components and the package for placing the components. Thirdly, according to the schematic diagram of the circuit board, the Place/interactive Routing menu can be directly used for manual routing. And the lastly, modify the circuit board, save or print files. 

 

Q: I have no gerber file, other file is it ok?

A: Of course, you can send other files to us, for exemple: CAD file, DXF file and Aligo, etc.

 

Q: I have no any pcb files, how can i do?

A: When you don’t have any PCB files, you can send us the schematic diagram of the PCB, and we can design your PCB for you

 

Process Capability And Checking Parameters(Rigid PCB)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times

 

pcb factory multilayer pcb manufacturer 12 layer circuit board FR4 material TG130 gold platting computer graphics pcb

 

 

 

 

Contact Details
Shenzhen Hengxunda Circuit Technology Co.,LTD

Contact Person: Ms. angelina

Tel: 86--15889447462

Fax: 86-755-23061612

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