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double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board

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Good quality Double Sided PCB
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PCB Assembly

PCB Assembly Sample Introduction

double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board

China double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board Supplier
double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board Supplier double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board Supplier

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Product Details:

Place of Origin: china
Brand Name: hascend
Certification: UL,TS16949
Model Number: HAS20016

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: 0.1usd
Packaging Details: carton
Delivery Time: 5-7working days
Payment Terms: TT/PAYPAL/Western Union
Supply Ability: 50000pcs/month
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Detailed Product Description
Base Material: FR4 Copper Thickness: 1oz
Board Thickness: 1.6mm Min. Hole Size: 0.2mm
Min. Line Width: 0.13mm Min. Line Spacing: 0.13mm
Surface Finishing: ENIG Number Of Layers: 4-Layer

double side pcb soldering double sided pcb doulbe sided fr4 pcb electronics assembly compononts clone pcb board

 

Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times

Contact Details
Shenzhen Hengxunda Circuit Technology Co.,LTD

Contact Person: Ms. angelina

Tel: 86--15889447462

Fax: 86-755-23061612

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